| Catalog Number |
ACMA00045204 |
| Description |
Single-phase submerged data center coolant can replace the traditional heat dissipation of the data center as a place for computing, storage, and information exchange, ensuring long-term stable and efficient operation of IT devices and reducing data center power consumption. |
| Boiling Point |
≥130 ℃ |
| Density |
≤1.85 g/cm³ |
| Solubility |
Solubility of water ≤ 0.005% |
| Appearance |
Nocolor & Clear |
| Decomposition Temperature |
300 ℃ |
| Dielectric Constant |
≤ 2 (10kHz) |
| Dielectric Dissipation Factor |
< 0.05 % |
| Dielectric Strength |
> 40 kV(2.54mm) |
| Feature |
1.Excellent thermal and chemical stability
2.Good thermal conductivity
3.Non-reactive with metal, plastic, elastomers and rubber
4.High dielectric strength
5.Low vapor pressure
6.Environmentally safe
7.Low viscosity
8.Non-toxic
9.No flash or fire points |
| Kinematic Viscosity |
≤ 6 (40℃)/(mm²/S) |
| Linear Thermal Expansion Coefficient |
≥ 0.0011 ℃-¹ |
| Neutralization Number |
≤ 0.03 (KOH)/(mg/g) |
| Pour Point |
≤ -45 ℃ |
| Specific Heat |
> 960 (J/Kg ·K) |
| Thermal Conductivity |
> 0.065 (W/m ·K) |
| Volume Resistivity |
≥ 1×10¹⁵ (Ω ·cm) |
※ Please kindly note that our products are for research use only.
