| Catalog Number |
ALFP000013 |
| Description |
EZ-IO-F is a thermally stable composite utilizing nanotechnology, spread weave, and PTFE. Its silica nanoparticles ensure drilling performance comparable to that of FR4 materials. The material contains a low fiberglass content, around 10% by weight. The spread weave provides a uniform dielectric constant and impedance, as confirmed by skew testing. Designed for the latest digital circuits, EZ-IO-F supports digital transmission speeds from 25 Gbps up to 112 Gbps. It's also tailored for high-frequency microwave applications that require the integration of digital and microwave circuits on a single printed wiring board (PWB). EZ-IO-F was developed to compete with top FR4 materials at the fabrication level in complex 30-40 layer digital applications. |
| Application |
Semiconductor testing at 25 gbps and higher/Test and measurement/Optical data transport & backplane routers/Hybrid FR4 PWBs combining microwave & Digital signals/Avonics and aerospace |
| Dielectric Constant |
2.80 +/- 0.05 |
| Dissipation Factor |
0.0015 |
| Feature |
Thermally stable composite based on nanotechnology, spread weave and PTFE |
| Features And Benefits |
Extremely low skew
Nanotechnology based PTFE laminate
Drill quality of FR4 (1000+ hits/bit)
Registration of FR4
Extremely low fiberglass content (~10 %)
<0.18 % DK variation within a lot
Temperature stable DK
Capable of 40+ layer large format PWBs
CAF Resistant |
| IPC Slash Sheet |
4103A/230 |
| Thermal Conductivity |
0.53 (W/mK) |
If you have any other questions or need other size, please get a quote.
※ Please kindly note that our products are for research use only.
