| Catalog Number |
ALFP000026 |
| Description |
TSM-DS3 is a highly stable, industry-leading core known for its low loss (DF = 0.0011 at 10 GHz) and can be produced with the reliability and consistency comparable to top fiberglass-reinforced epoxies. This material is a ceramic-filled composite with a minimal fiberglass content of about 5%, making it suitable for creating large, complex multilayer structures. TSM-DS3 is designed for high-power applications (thermal conductivity: 0.65 W/m*K), where effectively dissipating heat from other sources in PWB designs is crucial. Additionally, it features very low thermal expansion coefficients, ideal for challenging thermal cycling conditions. |
| Application |
Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antennas
Oil Drilling
Semiconductor / ATE Testing |
| Dielectric Constant |
3.0 +/- 0.05 |
| Dissipation Factor |
0.0014 |
| Feature |
Dimensionally stable low loss laminate |
| Features And Benefits |
Industry best DF (DF: 0.0011 @ 10GHz)
High thermal conductivity
Low (~5 %) fiberglass content
Dimensional stability rivals epoxy
Enables large format high layer count PWBs
Builds complex PWBs in yield with consistency and predictability
Temperature stable DK +/- 0.25 (-30 ° to 120 °C)
Compatible with resistor foils |
| IPC Slash Sheet |
4103A/230 |
| Thermal Conductivity |
0.65 (W/mK) |
If you have any other questions or need other size, please get a quote.
※ Please kindly note that our products are for research use only.
