Woven Glass Reinforced PTFE-TSM-DS3b

Catalog Number	ALFP000027
Description	TSM-DS3b is an industry-leading, thermally stable core with low loss (DF = 0.0011 at 10 GHz), offering manufacturing predictability and consistency on par with the finest fiberglass-reinforced epoxies. It is a ceramic-filled material with about 5% fiberglass content, comparable to epoxies in producing large, complex multilayer structures. TSM-DS3b is designed for high-power applications (TC: 0.65 W/m*K), where the dielectric needs to efficiently dissipate heat in PWB designs. Additionally, it boasts very low coefficients of thermal expansion, making it ideal for challenging thermal cycling conditions.
Application	Couplers Phased Array Antennas Radar Manifolds mmWave Antenna / Automotive Radar Oil Drilling Semiconductor / ATE Testing
Dielectric Constant	3.0 +/- 0.04
Dissipation Factor	0.0014
Feature	Dimensionally stable low loss laminate
Features And Benefits	Industry best DF (DF: 0.0011 @ 10GHz) High thermal conductivity Low (~5 %) fiberglass content Dimensional stability rivals epoxy Enables large format high layer count PWBs Builds complex PWBs in yield with consistency and predictability Temperature stable DK +/- 0.25 (-30 ° to 120 °C) Compatible with resistor foils
IPC Slash Sheet	4103A/230
Thermal Conductivity	0.65 (W/mK)

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