| Catalog Number |
ALFP000028 |
| Description |
TSM-DS3M is an industry-leading core known for its thermal stability and low loss, with a dielectric loss (DF) of 0.0011 at 10 GHz. It can be produced with the same reliability and precision as top fiberglass-reinforced epoxies. This ceramic-filled material has a minimal fiberglass content of around 5% and matches epoxies in producing large, complex multilayer structures. TSM-DS3M is designed for high-power applications, featuring a thermal conductivity of 0.65 W/m*K to efficiently dissipate heat from other components in a printed wiring board design. It also boasts very low thermal expansion coefficients, making it ideal for demanding thermal cycling environments. |
| Application |
Microstrip and stripline circuitry for avionics and aerospace applications
Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antenna
Oil Drilling
Semiconductor / ATE Testing |
| Dielectric Constant |
2.94 +/- 0.04 |
| Dissipation Factor |
0.0014 |
| Feature |
Dimensionally stable low loss laminate |
| Features And Benefits |
Industry best DF (DF: 0.0011 @ 10GHz)
High thermal conductivity
Low Z axis expansion for avionics and aerospace applications
Low (~5 %) fiberglass content
Dimensional stability rivals epoxy
Enables large format high layer count PWBs
Builds complex PWBs in yield with consistency and predictability
Temperature stable DK +/- 0.25 (-30 °C to 120 °C)
Compatible with resistive foils |
| IPC Slash Sheet |
4103A/230 |
| Thermal Conductivity |
0.65 (W/mK) |
If you have any other questions or need other size, please get a quote.
※ Please kindly note that our products are for research use only.
