Ceramic Filled PTFE

Name	CAS number	Description
Ceramic Filled PTFE-NF-30
NF-30 copper-clad, non-reinforced laminates are composed of ceramic-filled PTFE composites. This technology provides low dielectric loss and minimal signal distortion, making it ideal for microwave applications. NF-30 performs consistently across a broad range of frequencies, particularly between 77 and 79 GHz.
Ceramic Filled PTFE-RF-10
RF-10 copper clad laminates consist of ceramic-filled PTFE combined with woven fiberglass. RF-10 benefits from a high dielectric constant and a low dissipation factor. The use of thin woven fiberglass reinforcement provides low dielectric loss, enhanced rigidity for easier handling, and better dimensional stability, making it suitable for multilayer circuits.
Ceramic Filled PTFE-RF-30A
RF-30A, is an organic-ceramic laminate reinforced with woven glass. Developed from specialized knowledge in ceramic fillers and PTFE coatings, RF-30A is the ideal option for affordable, large-scale commercial microwave and radio frequency uses.
Ceramic Filled PTFE-RF-35HTC
RF-35HTC is a top-performing, low-loss, thermally conductive laminate without reinforcement. With a thermal conductivity of 1.84 W/m*K, it is ideal for high-power applications such as amplifiers, couplers, dividers, and filters. This material is a ceramic/PTFE composite with minimal PTFE content. Its exceptionally low loss of 0.0007 at 10 GHz makes it especially appealing for high-power use.
Ceramic Filled PTFE-RF-35TC
The RF-35TC material is renowned for its exceptional low dissipation factor and excellent thermal conductivity, making it ideal for high-power applications where even minor losses, such as every 0.1 dB, are significant. It serves effectively as a printed wiring board (PWB) substrate, efficiently dissipating heat from transmission lines and surface-mounted components like transistors or capacitors. Composed of a PTFE-based, ceramic-filled fiberglass substrate, RF-35TC does not oxidize, yellow, or exhibit an increase in dielectric constant and dissipation factor, unlike synthetic rubber (hydrocarbon) alternatives.
Ceramic Filled PTFE-RF-35TC-A
RF-35TC-A laminates feature a woven fiberglass fabric matrix coated with PTFE filled with ceramic. This unique ceramic composition allows RF-35TC-A to maintain a low dissipation factor while also offering high thermal conductivity. Unlike its synthetic rubber (hydrocarbon) counterparts, it does not oxidize, yellow, or exhibit increases in dielectric constant and dissipation factor. RF-35TC-A is ideal for high power applications.
Ceramic Filled PTFE-RF-60TC
RF-60TC is a fiberglass substrate made of PTFE and ceramic, specifically engineered for high-power RF and microwave applications. It is optimized to reduce operating temperatures in high-power settings and enhance the performance and efficiency of compact antennas in the 6.15 DK market. This is achieved through improved dissipation of dielectric heat and extremely low dielectric losses.
Ceramic Filled PTFE-TLF-35A
TLF-35A is an organic-ceramic laminate part. It is ideal for cost-effective, large-scale microwave and radio frequency applications. The advanced version of TLF-35A features excellent peel strength for both ½ ounce and 1 ounce copper and is engineered for outstanding high-frequency performance. It retains the same electrical properties as TLF-35A but offers more precise DK tolerance.
Ceramic Filled PTFE-TLY-5Z
TLY-5Z laminates are cutting-edge glass-filled PTFE composites reinforced with woven fiberglass. Designed for low-density applications like aerospace, they meet strict weight requirements, leading to a dimensionally stable material that non-reinforced PTFE cannot achieve. This low-density design also ensures minimal Z axis expansion, a feature uncommon in PTFE-rich composites. Compared to traditional low dielectric PTFE composites, TLY-5Z offers significantly greater thermal stability concerning Z axis expansion-induced stress on plated through holes.
Ceramic Filled PTFE-TSM-DS3
TSM-DS3 is a thermally stable, low-loss core (DF = 0.0011 at 10 GHz) renowned in the industry. It can be produced with the same reliability and consistency as top-quality fiberglass-reinforced epoxies. As a ceramic-filled reinforced material, TSM-DS3 contains minimal fiberglass content (around 5%) and competes with epoxies in creating large, complex multilayer structures. It was developed for high-power uses (with a thermal conductivity of 0.65 W/m*K) where it's crucial for the dielectric material to dissipate heat from other sources in printed wiring board designs. Additionally, TSM-DS3 features very low thermal expansion coefficients, making it suitable for challenging thermal cycling conditions.
Ceramic Filled PTFE-TSM-DS3b
TSM-DS3b is an industry-leading, thermally stable core known for its low loss (DF = 0.0011 at 10 GHz) and can be produced with the reliability and consistency of top-tier fiberglass-reinforced epoxies. This material is ceramic-filled and reinforced with minimal fiberglass content (approximately 5%), making it comparable to epoxies for the production of large, complex multilayer structures. Designed for high-power applications, TSM-DS3b efficiently conducts heat away from heat sources in printed wiring board (PWB) designs due to its thermal conductivity (TC: 0.65 W/m*K). Additionally, TSM-DS3b features very low thermal expansion coefficients, making it ideal for challenging thermal cycling conditions.
Ceramic Filled PTFE-TSM-DS3M
TSM-DS3M is an industry-leading, thermally stable core with low loss (DF = 0.0011 at 10 GHz) that offers the same predictability and consistency in production as top fiberglass-reinforced epoxies. This ceramic-filled material is reinforced with minimal fiberglass content (around 5%) and competes with epoxies for creating large, complex multilayer structures. Designed for high-power applications, TSM-DS3M efficiently conducts heat away from other sources in PWB designs (TC: 0.65 W/m*K). It also features very low thermal expansion coefficients, making it suitable for rigorous thermal cycling demands.