| Catalog Number |
ALFP000010 |
| Description |
TSM-DS3 is a thermally stable, low-loss core (DF = 0.0011 at 10 GHz) renowned in the industry. It can be produced with the same reliability and consistency as top-quality fiberglass-reinforced epoxies. As a ceramic-filled reinforced material, TSM-DS3 contains minimal fiberglass content (around 5%) and competes with epoxies in creating large, complex multilayer structures. It was developed for high-power uses (with a thermal conductivity of 0.65 W/m*K) where it's crucial for the dielectric material to dissipate heat from other sources in printed wiring board designs. Additionally, TSM-DS3 features very low thermal expansion coefficients, making it suitable for challenging thermal cycling conditions. |
| Application |
Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antennas
Oil Drilling
Semiconductor / ATE Testing |
| Dielectric Constant |
3.0 +/- 0.05 |
| Dissipation Factor |
0.0014 |
| Feature |
Dimensionally stable low loss laminate |
| Features And Benefits |
Industry best DF (DF: 0.0011 @ 10GHz)
High thermal conductivity
Low (~5 %) fiberglass content
Dimensional stability rivals epoxy
Enables large format high layer count PWBs
Builds complex PWBs in yield with consistency and predictability
Temperature stable DK +/- 0.25 (-30 ° to 120 °C)
Compatible with resistor foils |
| IPC Slash Sheet |
4103A/230 |
| Thermal Conductivity |
0.65 (W/mK) |
If you have any other questions or need other size, please get a quote.
※ Please kindly note that our products are for research use only.
