| Catalog Number |
ALFP000011 |
| Description |
TSM-DS3b is an industry-leading, thermally stable core known for its low loss (DF = 0.0011 at 10 GHz) and can be produced with the reliability and consistency of top-tier fiberglass-reinforced epoxies. This material is ceramic-filled and reinforced with minimal fiberglass content (approximately 5%), making it comparable to epoxies for the production of large, complex multilayer structures. Designed for high-power applications, TSM-DS3b efficiently conducts heat away from heat sources in printed wiring board (PWB) designs due to its thermal conductivity (TC: 0.65 W/m*K). Additionally, TSM-DS3b features very low thermal expansion coefficients, making it ideal for challenging thermal cycling conditions. |
| Application |
Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antenna / Automotive Radar
Oil Drilling
Semiconductor / ATE Testing |
| Dielectric Constant |
3.0 +/- 0.04 |
| Dissipation Factor |
0.0014 |
| Feature |
Dimensionally stable low loss laminate |
| Features And Benefits |
Industry best DF (DF: 0.0011 @ 10GHz)
High thermal conductivity
Low (~5 %) fiberglass content
Dimensional stability rivals epoxy
Enables large format high layer count PWBs
Builds complex PWBs in yield with consistency and predictability
Temperature stable DK +/- 0.25 (-30 ° to 120 °C)
Compatible with resistor foils |
| IPC Slash Sheet |
4103A/230 |
| Thermal Conductivity |
0.65 (W/mK) |
If you have any other questions or need other size, please get a quote.
※ Please kindly note that our products are for research use only.
