Fluoropolymers / Alfa Chemistry
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Ceramic Filled PTFE-TSM-DS3M

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Catalog Number ALFP000012
Description TSM-DS3M is an industry-leading, thermally stable core with low loss (DF = 0.0011 at 10 GHz) that offers the same predictability and consistency in production as top fiberglass-reinforced epoxies. This ceramic-filled material is reinforced with minimal fiberglass content (around 5%) and competes with epoxies for creating large, complex multilayer structures. Designed for high-power applications, TSM-DS3M efficiently conducts heat away from other sources in PWB designs (TC: 0.65 W/m*K). It also features very low thermal expansion coefficients, making it suitable for rigorous thermal cycling demands.
Application Microstrip and stripline circuitry for avionics and aerospace applications
Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antenna
Oil Drilling
Semiconductor / ATE Testing
Dielectric Constant 2.94 +/- 0.04
Dissipation Factor 0.0014
Feature Dimensionally stable low loss laminate
Features And Benefits Industry best DF (DF: 0.0011 @ 10GHz)
High thermal conductivity
Low Z axis expansion for avionics and aerospace applications
Low (~5 %) fiberglass content
Dimensional stability rivals epoxy
Enables large format high layer count PWBs
Builds complex PWBs in yield with consistency and predictability
Temperature stable DK +/- 0.25 (-30 °C to 120 °C)
Compatible with resistive foils
IPC Slash Sheet 4103A/230
Thermal Conductivity 0.65 (W/mK)

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