Catalog Number | ALFP000012 |
Description | TSM-DS3M is an industry-leading, thermally stable core with low loss (DF = 0.0011 at 10 GHz) that offers the same predictability and consistency in production as top fiberglass-reinforced epoxies. This ceramic-filled material is reinforced with minimal fiberglass content (around 5%) and competes with epoxies for creating large, complex multilayer structures. Designed for high-power applications, TSM-DS3M efficiently conducts heat away from other sources in PWB designs (TC: 0.65 W/m*K). It also features very low thermal expansion coefficients, making it suitable for rigorous thermal cycling demands. |
Application | Microstrip and stripline circuitry for avionics and aerospace applications Couplers Phased Array Antennas Radar Manifolds mmWave Antenna Oil Drilling Semiconductor / ATE Testing |
Dielectric Constant | 2.94 +/- 0.04 |
Dissipation Factor | 0.0014 |
Feature | Dimensionally stable low loss laminate |
Features And Benefits | Industry best DF (DF: 0.0011 @ 10GHz) High thermal conductivity Low Z axis expansion for avionics and aerospace applications Low (~5 %) fiberglass content Dimensional stability rivals epoxy Enables large format high layer count PWBs Builds complex PWBs in yield with consistency and predictability Temperature stable DK +/- 0.25 (-30 °C to 120 °C) Compatible with resistive foils |
IPC Slash Sheet | 4103A/230 |
Thermal Conductivity | 0.65 (W/mK) |
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