Glass/Glass Fiber Filled PTFE - Fluoropolymers / Alfa Chemistry

Name	CAS number	Price
MT031	9002-84-0	Inquiry

MT034	9002-84-0	Inquiry

FT007		Inquiry

FT008		Inquiry

FT012		Inquiry

FT013		Inquiry

FT015		Inquiry

PTFE + 25% Glass Polytetrafluoroethylene with 25% Glass		Inquiry
Properties:Improved compression and wear resistanceExcellent chemical stabilityBetter thermal conductivityApplications: Dynamic seals with rotating or alternating motion.
PTFE 25% glass filled		Inquiry
Improved compressive strength and wear resistance.
PTFE G403 Polytetrafluoroethylene 15% Glass Fiber		Inquiry
PTFE G Standard Compound with glass fiberProperties: Enhanced wear resistance. Enhanced chemical resistance (except for alkali and hydrofluoric acid).Applications: Valve seats, seals, bearings, required to resist sliding and chemicals.
PTFE G405 Polytetrafluoroethylene 25% Glass Fiber		Inquiry
PTFE G Standard Compound with glass fiberProperties: Enhanced wear resistance. Enhanced chemical resistance (except for alkali and hydrofluoric acid).Applications: Valve seats, seals, bearings, required to resist sliding and chemicals.
PTFE, 20% Glass Fiber Filled		Inquiry
PTFE compounds have the following advantage over unfilled PTFE:Improved compression strengthImproved thermal conductivityDecreased thermal expansionImproved abrasion resistanceApplications:Gaskets, Valve Seals, Packings, Bearing Pads, Piston Rings
PTFE, 20% Glass Fiber, 5% Graphite Filled		Inquiry
PTFE compounds have the following advantage over unfilled PTFE:Improved compression strengthImproved thermal conductivityDecreased thermal expansionImproved abrasion resistanceApplications:Gaskets, Valve Seals, Packings, Bearing Pads, Piston Rings
PTFE, 25% Glass Fiber Filled		Inquiry
PTFE compounds have the following advantage over unfilled PTFE:Improved compression strengthImproved thermal conductivityDecreased thermal expansionImproved abrasion resistanceApplications:Gaskets, Valve Seals, Packings, Bearing Pads, Piston Rings
RO3210 Woven-Glass Reinforced PTFE Laminate		Inquiry
Decomposition Temperature: 500 °C; Dimensional Stability: 0.8 mm/m; Thermal Coefficient of Dielectric Constant: -459 ppm/°C
Woven Glass Reinforced PTFE-EZ-IO-F		Inquiry
EZ-IO-F is a thermally stable composite utilizing nanotechnology, spread weave, and PTFE. Its silica nanoparticles ensure drilling performance comparable to that of FR4 materials. The material contains a low fiberglass content, around 10% by weight. The spread weave provides a uniform dielectric constant and impedance, as confirmed by skew testing. Designed for the latest digital circuits, EZ-IO-F supports digital transmission speeds from 25 Gbps up to 112 Gbps. It's also tailored for high-frequency microwave applications that require the integration of digital and microwave circuits on a single printed wiring board (PWB). EZ-IO-F was developed to compete with top FR4 materials at the fabrication level in complex 30-40 layer digital applications.
Woven Glass Reinforced PTFE-RF-10		Inquiry
RF-10 copper clad laminates combine ceramic-filled PTFE with woven fiberglass. These laminates feature a high dielectric constant and a low dissipation factor. The use of thin woven fiberglass reinforcement ensures low dielectric loss and enhances rigidity, making them easy to handle and providing improved dimensional stability for multilayer circuits.
Woven Glass Reinforced PTFE-RF-30A		Inquiry
RF-30A is an organic-ceramic filled laminate and features woven glass reinforcement. It is the product of advanced skills in ceramic fillers and PTFE coating technology. RF-30A is ideal for affordable, high-volume commercial microwave and radio frequency applications.
Woven Glass Reinforced PTFE-RF-35HTC		Inquiry
RF-35HTC is a top-performing, non-reinforced thermally conductive laminate with low loss characteristics. Its high thermal conductivity of 1.84 W/m*K makes it ideal for high-power applications such as amplifiers, couplers, dividers, and filters. Composed of a ceramic/PTFE blend with minimal PTFE content, RF-35HTC boasts an exceptionally low loss of 0.0007 at 10 GHz, making it highly desirable for these applications.
Woven Glass Reinforced PTFE-RF-35TC		Inquiry
RF-35TC provides an outstanding combination of low dissipation factor and high thermal conductivity. This material is ideal for high-power applications where even a slight change in performance, such as 0.1 dB, is important, and the printed wiring board (PWB) substrate needs to efficiently disperse heat from both transmission lines and surface-mounted components like transistors or capacitors. Made from a PTFE base with ceramic-filled fiberglass, RF-35TC resists oxidation, yellowing, and does not experience the upward drift in dielectric constant and dissipation factor seen in synthetic rubber (hydrocarbon) alternatives.

Properties:Improved compression and wear resistanceExcellent chemical stabilityBetter thermal conductivityApplications: Dynamic seals with rotating or alternating motion.

Improved compressive strength and wear resistance.

PTFE G Standard Compound with glass fiberProperties: Enhanced wear resistance. Enhanced chemical resistance (except for alkali and hydrofluoric acid).Applications: Valve seats, seals, bearings, required to resist sliding and chemicals.

PTFE compounds have the following advantage over unfilled PTFE:Improved compression strengthImproved thermal conductivityDecreased thermal expansionImproved abrasion resistanceApplications:Gaskets, Valve Seals, Packings, Bearing Pads, Piston Rings

Decomposition Temperature: 500 °C; Dimensional Stability: 0.8 mm/m; Thermal Coefficient of Dielectric Constant: -459 ppm/°C

EZ-IO-F is a thermally stable composite utilizing nanotechnology, spread weave, and PTFE. Its silica nanoparticles ensure drilling performance comparable to that of FR4 materials. The material contains a low fiberglass content, around 10% by weight. The spread weave provides a uniform dielectric constant and impedance, as confirmed by skew testing. Designed for the latest digital circuits, EZ-IO-F supports digital transmission speeds from 25 Gbps up to 112 Gbps. It's also tailored for high-frequency microwave applications that require the integration of digital and microwave circuits on a single printed wiring board (PWB). EZ-IO-F was developed to compete with top FR4 materials at the fabrication level in complex 30-40 layer digital applications.

RF-10 copper clad laminates combine ceramic-filled PTFE with woven fiberglass. These laminates feature a high dielectric constant and a low dissipation factor. The use of thin woven fiberglass reinforcement ensures low dielectric loss and enhances rigidity, making them easy to handle and providing improved dimensional stability for multilayer circuits.

RF-30A is an organic-ceramic filled laminate and features woven glass reinforcement. It is the product of advanced skills in ceramic fillers and PTFE coating technology. RF-30A is ideal for affordable, high-volume commercial microwave and radio frequency applications.

RF-35HTC is a top-performing, non-reinforced thermally conductive laminate with low loss characteristics. Its high thermal conductivity of 1.84 W/m*K makes it ideal for high-power applications such as amplifiers, couplers, dividers, and filters. Composed of a ceramic/PTFE blend with minimal PTFE content, RF-35HTC boasts an exceptionally low loss of 0.0007 at 10 GHz, making it highly desirable for these applications.

RF-35TC provides an outstanding combination of low dissipation factor and high thermal conductivity. This material is ideal for high-power applications where even a slight change in performance, such as 0.1 dB, is important, and the printed wiring board (PWB) substrate needs to efficiently disperse heat from both transmission lines and surface-mounted components like transistors or capacitors. Made from a PTFE base with ceramic-filled fiberglass, RF-35TC resists oxidation, yellowing, and does not experience the upward drift in dielectric constant and dissipation factor seen in synthetic rubber (hydrocarbon) alternatives.